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      Shin-Etsu Polymer’s packaging and carrier materials are designed to ptotect silicon wafers and devices from p文章 contamination during transportation. Our packaging materials are comprehensively designed using the right combination of material selection, precision compound, and analysis technologies. Technological strengths include evaluation technologies such as material engineering and wafer investigation, clean environment control, precision molding and design that precisely meet evolving customer requirements.

      Applications

      • Wafer shipping boxes for wafer shipments and front opening unified pods("FOUP") to hold wafers during process handling
      皇冠官网手机地址
      For Inquiries About This Product
      • Company:
        Shin-Etsu Polymer Co., Ltd.
      • Department:
        Sales Unit Sales & Marketing Division Ⅲ
      • Phone:
        +81-3-5289-3739
      
          皇冠注册官网地址978534459597346
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